1. Design and simulation
Electrical simulation, thermal management and thermal mechanical reliability simulation, process simulation.
2. Advanced Packaging
a) SiP packaging, advanced sensor packaging, high-speed and high-density packaging, high-speed and high-frequency packaging,
CIS packaging, 3D packaging.
b) Substrates: high density substrates, coreless substrates, glass substrates.
3. Testing
c) Electrical test:signal integrity, power integrity, analog, digital, RF, EMI.
d) Reliability test and failure analysis:a variety of advanced reliability test and failure analysis equipment, such as DMA, TMA, TGA, X-ray.
e) Thermal test