NCAP
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NCAP can provide the standard dummy wafer with the following specifications. If other requirement, can be customized also.
| RDL | TSV | Bumping | Oxide Wafer | Cu Wafer |
1. RDL
Specifications:
Item | Single Side RDL | Double Side RDL |
Min Si Thickness | 60um | 60um |
Copper Thickness | >6um | >6um |
Copper Line/Space | Min 10um/10um | Min 10um/10um |
Chip Size | Target ±20um | Target ±20um |
Min Chip Size | 0.6mm×0.3mm | 0.6mm×0.3mm |
Tape&Reel | Min die thickness 90um | Min die thickness 90um |
Structure Diagram:
2. TSV
Specifications:
Item | TSV 10:100 | TSV 20:200 |
Wafer size | 300mm | 300mm |
Si Thickness | 100um±10um | 200um±10um |
Via size | 10um±1.5um | 20um±3um |
Metal layers | Top side：3 | Top side：3 |
Copper Line/Space | Min 10um/10um | Min 10um/10um |
Micro Bump Pitch | Min 40um | Min 40um |
Structure Diagram:
3. Bumping
Specifications:
Item | Wafer Bumping |
Wafer Size | 300mm/200mm |
Bump Pitch | Min 80um |
Bump Size | Min 50um |
Bump Height | <80um |
RDL Line/Space | Min 10um/10um |
Structure Diagram:
4. Oxide Wafer
Specifications:
Item | Oxide Wafer | Oxide Wafer |
Wafer size | 300mm | 200mm |
SiO2 Thickness | 0.1um~6um | 0.1um~6um |
5. Cu Wafer
Specifications:
Item | Cu Wafer | Cu Wafer |
Wafer size | 300mm | 200mm |
Cu Thickness | ≥1um | ≥1um |
