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Packaging Design & Simulation
• Package Design
• System Simulation
Mid-End Wafer Level Packaging Technology
• Bumping
• Wafer Level Chip Scale Package
• Wafer Level Fan out Package
• TSV & Interposer
Microsystem Integration Technology
• Grinding & Dice
• LGA&BGA Package
• Heat Sink FCBGA Package
• SiP Package
Test & Analysis
• CP & FT Test
• Material Characterization
• Failure Analysis
• Reliability Test
Optoelectronic Devices Packaging Technology
• Optoelectronic Devices Packaging Technology
Microsystem Integration Technology -
SiP Package
SiP Package
典型SiP封装结构示意图
制造工艺流程
