Incoming Si wafer size

6”, 8”, 12”

Si wafer grinding Thk

≥150um

W/O Pillar

3

PnP die size range

1.0 x1.0mm~ 8.0x8.0mm

4

PnP passives size range

0402, 0603

5

Molding Thk range

0.5~ 1.0mm

6

RDL L/S

10/10um

7

RDL Layer

2 layers

8

BGA size

200um