The National Center for Advanced Packaging (NCAP China), registered in Wuxi, China in 2012, is a joint venture established by several investors, including the leaders of the IC packaging and testing industry in China, atnd the Institute of Microelectronics of Chinese Academy of Sciences.
As a national center for advance packaging, testing and system integration, NCAP, in collaboration with system OEM’s and supply chain partners, aggressively pursues research and development in order to offer total solutions for the IC industry. NCAP’s current research directions include: 2.5D/3D technology (including TSV), high density wafer level packaging, SiP product development capabilities, and certain advanced materials and equipment technologies for microelectronics packaging.
technology application
World Class R&D and Commercialization Center for Advanced Packaging & System Integration
Up to the end of 2018, 724 patents have been applied, including 658 invention patents and 28 international patents
Packaging Substrates
An advanced substrate fabrication line enables us to produce substrates with 25/25um line/space(machining tolerance under +5%),with minimum line/space 15/15um and minimum laser aperture 50um.
NCAP has taken initial step as a domestic leading and international R&D center for semiconductor advanced packaging and testing, and a biggest platform for applying and verifying domestic equipment as well as mentoring and training talents.
1000+
In recent years, NCAP has undertaken 16 science and technology projects (including National Science and Technology Major Project, 973 project, 863 project, National Natural Science Foundation project, and projects of province and city)
contact us
If you are interested in NCAP welcome to join us!
86-510-66679336
Building D1, China Sensor Network International Innovation Park, 200 Linghu Boulevard, Wuxi City, Jiangsu Province, China
