National Center for Advanced Packaging (NCAP China)
The National Center for Advanced Packaging (NCAP China), registered in Wuxi, China in 2012, is a joint venture established by several investors, including the leaders of the IC packaging and testing industry in China, and the Institute of Microelectronics of Chinese Academy of Sciences.
As a national center for advance packaging, testing and system integration, NCAP, in collaboration with system OEM’s and supply chain partners, aggressively pursues research and development in order to offer total solutions for the IC industry. NCAP’s current research directions include: 2.5D/3D technology (including TSV), high density wafer level packaging, SiP product development capabilities, and certain advanced materials and equipment technologies for microelectronics packaging.