The technical team of NCAP China consists of senior technical leaders who had years of working experience in overseas firms /corporations and/or in domestic institutions or companies. Rest of them were recent graduates from universities in China or foreign countries. Nearly half of technical team members owned doctorate or master’s degrees from institutions in China or at abroad.

The technical capabilities of current technical team cover a variety of advanced packaging technologies, including wafer level and panel level high-density packaging, TSV integration， 2.5D and 3D system integration, system in packages（SiP）, and numerous generic packaging technologies.

The Core Leaders of NCAP technical team are the following:

Liqiang Cao, PhD in microelectronics from Charmers University of Technology, is currently CEO & President of NCAP China. He was bestowed upon Core Member of Jiangsu province “Most Innovative and Entrepreneurial Group”, CAS Expert of “Hundred-Talent Plan”, and Wuxi city Expert of “333 High-level Talent Project”.

Dr. Cao started his technical career on system-level packaging technology from the September of 2000 in Institute of Swedish National Industrial Product Research, Nordic Micro-System Integration Technology Center. In October, 2005, he joined Intel as a project manager and senior researcher, and later as a R&D manager. In February, 2009, he was bestowed upon "Hundred-Talent Plan" Expert by the Chinese Academy of Sciences and appointed as a full professor and principal investigator. Afterwards, he has served as an academic advisor for doctorate candidates in CAS Institute of Microelectronics and other universities in China. He has led or participated in numerous key national research projects, such as National 02 Projects, 973 projects, and Natural Science Fund Projects.

In addition to his NCAP duties, Dr. Cao was selected as a CPPCC member in Xinwu district of Wuxi city in 2016. Currently, he is the Deputy Chairman and Deputy Secretary-General of the National Technology Innovation Strategic Alliance for IC Assembling and Testing; a member of General Expert Group for National Science and Technology Key Projects, an expert judge for both National Natural Science Fund and Zhejiang Natural Science Fund. He also serves as an adjunct professor in Fudan University, Central South University, and the University of Chinese Academy of Sciences as an academic advisor for doctoral candidates. In addition, he serves as a peer reviewer for numerous technical periodicals, such as Journal of Material Science, Journal of Electronic Packaging, Journal of Soldering and Surface Mount Technology, IEEE CMPT Trans., Microelectronic Reliability. He has also chaired numerous technical conferences, such as ECTC, ESTC, and EPTC.

He has published more than 200 technical papers, and applied for more than 50 Chinese and foreign invention patents, and edited or translated 5 books or book chapters.

Wenqi Zhang, PhD in microelectronics from the University of Leuven, is a technical director of NCAP. He was bestowed upon national Expert of “Thousand-Talent Plan”, Jiangsu province Talent of “Innovation and Entrepreneur Plan”, as well as Core Member of Jiangsu province “Most Innovative and Entrepreneurial Group”.

Dr. Zhang has published about 100 technical papers and filed a number of international and Chinese invention patents. He has chaired numerous international technical conferences.

Tingyu Lin, PhD from National University of Singapore, is a chief scientist of NCAP. He was bestowed upon national Expert from “Thousand-Talent Plan”, Jiangsu province Talent of “Innovation and Entrepreneur Plan”, and Core Member of Jiangsu province “Most Innovative and Entrepreneurial Group”.

He served as a senior project manager at global supply chain department in Motorola for more than 10 years. Had saved $3.5 million for Motorola, he was a certified Six Sigma Black Belt by the company. He won the quality improvement award twice, and established a world-class standard for PCBA/SMT process design. Dr. Lin has published more than 40 technical papers, among which 2 articles were awarded as the best paper.

Peng Sun, PhD in microelectronics from Charmers University of Technology, is a technical director of NCAP. He was bestowed upon Core Member of Jiangsu province “Most Innovative and Entrepreneurial Group”.

Prior to joining NCAP China in Nov 2012, he worked as a senior engineer at material and packaging BU of ASTRI and principal engineer at STATS ChipPAC FCE BU, respectively. Dr. Sun has been in charge of packaging technology roadmap, new product development and industrialization. He has authored more than 20 technical papers published in domestic and foreign technical journals and conferences. He has 2 US patents granted and filed 30 more Chinese patents. In addition, he participated in the English to Chinese translation of book of Lead-Free Solder Interconnect Reliability.

Daping Yao, PhD in Materials Science and Engineering from the University of Illinois, is a technical director of NCAP. He was bestowed upon Jiangsu province Talent of “Innovation and Entrepreneur Plan” and JITRI Principal Investigator.

Dr. Yao served as a senior member of technical staff and metal CVD core team leader in Applied Materials Inc., Santa Clara, California, USA, where he had worked over 20 years. He has had near 50 technical articles published in various peer reviewed journals and international conferences. He has over 20 patents issued in USA and China.