National Center for Advanced Packaging (NCAP China)

As an innovation model, National Center for Advanced Packaging Co., Ltd. (NCAP China) was registered in Wuxi New District, China, in September 2012. It’s supported by Wuxi and Jiangsu government, National Science and Technology Major Project(02 Project) and IC Packaging and Testing Industry Chain Technology Innovation Strategic Alliance. NCAP China, a joint venture with a capital of 234.45 million, is established by ten investors, including the leaders of the IC packaging and testing industry in China (Jiangsu Changjiang Electronics Technology, TongFu Microelectronics, Huatian Technology, Shennan Circuit Company, China Wafer Level CSP, AKM Electronic Technology (Suzhou), Jiangsu CAS Internet-of-things Technology Venture Capital, Shenzhen Fastprint Circuit Tech) and CDB Capital. 

NCAP’s goal is to establish a national R&D center for advanced packaging and system integration, play a global leading role in the development and commercialization of advanced technologies for microelectronics packaging and system integration, and promote and sustain the technological and commercial advancement of the microelectronics industry in China.

As a national center for advanced packaging, testing and system integration, NCAP aggressively pursues research and development through close collaboration with industry, colleges and institutes, in order to offer total solutions for the semiconductor industry. NCAP’s current research directions include: 2.5D/3D TSV and integration technologies (including TSV, bumping, via-reveal and chip-stacking), high density wafer level packaging, SiP product application and development, and verification and development of related advanced materials and equipment for microelectronics packaging.

The NCAP's R&D team is composed of the experts and leaders with rich experience in technical and management positions in internationally renowned enterprises and institutions at home and abroad, and more than 100 R & D staff are developed, of which more than half have doctorates and master's degrees.

NCAP R&D platform includes 3200㎡ cleanroom, equipped with facilities, for 300mm wafer size 2.5D/3D IC backend processes and packaging assembly, testing and reliability, as well as design and simulation capabilities.

NCAP was nominated as Institute of Advanced Packaging at provincial level, an affiliate of Jiangsu Industrial Technology Research Institute in 2015. In the light of the policy, that is “enterprises as a leading role for innovation, market orientation and industry-university-research cooperation”, and under the requirement of building a top innovative platform and team, NCAP accelerates the development of key generic technology for advanced packaging, enhances the value of contract research and promotes system innovation and practice.

In recent years, NCAP has undertaken more than 20 science and technology projects (including National Science and Technology Major Project, 973 project, 863 project, National Natural Science Foundation project, and projects of province and city) and served for hundreds of companies (companies from Jiangsu accounting for 1/3) . NCAP pioneered and developed a complete process for 2.5D TSV interposer and system integration, reaching an international advanced level and winning a prize of 10th China Semiconductor Innovative Product and Technology in 2015. In addition, NCAP also obtained many other honors, such as Beijing Science and Technology Prize (2016, 2018), the Chinese Institute of Electronics Science and Technology Prize (2017), A High Growth Company and A Gazelle Company in South Jiangsu National Innovation Demonstration Zone (2018), Science and Technology Prize of Guangdong Province and Shenzhen Science and Technology Prize (2019), R&D Enterprise of Jiangsu Province（2019）.As of March 2020, 842 patents have been applied, including 743 invention patents and 36 international patents, and 366 invention patents and 12 international patents have been issued. 

NCAP has taken initial step as a domestic leading and international R&D center for semiconductor advanced packaging and testing, and a biggest platform for applying and verifying domestic equipment as well as mentoring and training talents.