Welcome to the National Center for Advanced Packaging (NCAP China), a joint venture established by the leaders of the IC packaging and testing industry in China. NCAP, in collaboration with system OEM’s and supply chain partners, aggressively pursues research and development in advanced packaging, testing and system integration, in order to offer total solutions for the IC packaging industry.

In the next few years, the work of NCAP will be guided by the needs of the market to serve and promote the IC industry. NCAP will focus on building a world class platform for R&D, commercialization, international technical exchange, and mentoring and training of talents for the IC industry and the supply chain. Through this platform, NCAP will develop advanced technologies and commercialize such technologies through the transfer of total solutions to the industry. NCAP’s current research directions include: 2.5D/3D technology (including TSV), high density wafer level packaging, SiP product development capabilities, and certain advanced materials and equipment technologies for microelectronics packaging.

Our core values are collaboration, innovation, perseverance, and excellence. We look forward to working with our partners throughout the industry in our endeavor to build a world class R&D and commercialization center for advanced packaging and system integration to help propel the IC industry to a new level.

We will get there, together.