凸点

 1P1M, Pillar on Pad w/ PI

 2P2M, Pillar on RDL w/ PI

 Bumping packaging service (8”and 12”)

 Dielectric material: PI/PBO

 UBM: Ti/Cu/Ni sputtering target, Cu/Ni plating

 RDL Line/Space: min. 10um/10um

 Cu Pillar Pitch: min. 85um

 Sn-Ag Bump Pitch: min. 150um

 Bump Material：Sn-Ag or Cu Pillar + Sn Cap