晶圆级扇入封装

1M，Ball on Pad

1P1M，Ball on Pad w/ PI

2P1M，Ball on RDL w/o UBM

2P2M，Ball on RDL w/ UBM

WLCSP (8”and 12”)

Max. Die Size: 6x6mm

Wafer Thickness: 12”, Min.300μm

Dielectric Material: PI/PBO

UBM:  Ti/Cu/Ni, Plated Cu

RDL Line/Space: min. 10um/10um

WLCSP Ball Pitch: 0.40mm or 0.50mm