- •Design and implementation of a high-coupling and multi-channel optical transceiver with a novel packaging structure, IEEE TRANSACTIONS ON COMPONENTS,PACKAGING AND MANUFACTURING TECHNOLOGY, 7(11), 1882 – 1890,2017
- •Fabrication and performance analysis of a high-coupling-efficiency and convenient-integration optical transceiver, Optoelectronics Letters, 13(4), 0250-0253, 2017
- •Experimental Verification and Optimization Analysis of Warpage for Panel Level Fan-out Package IEEE Transactions on Components, Packaging and Manufacturing Technology, 7(10), 1721-1728, 2017
- •A MEMS thermal shear stress sensor produced by a combination of substrate-free structures with anodic bonding technology, Applied Physics Letters, 109(2),023512-1/023512-5,2016.
- •Stress analysis and parametric studies for a ultralow-k chip in the flip chip process,Microelectronics Reliability, 65, 198-204, 2016
- •Thermal stress analysis of the low-k layer in a flip-chip package, Microelectronic Engineering, 163, 78–82, 2016
- •Silicon interposer process development for advanced system integration, J. Microelectronic Engineering, 156, 50-54, 2016
- •Optimization and validation of thermal management for a RF front-end SiP based on rigid-flex substrate, Microelectronics Reliability, 65, 98-107, 2016
- •Research on Optical Transmitter and Receiver Module Used for High Speed Interconnection between CPU and Memory Fiber and Integrated Optics, 35(5), 18, 2016
- •High Frequency Characterization and Analysis of Through Silicon Vias and Coplanar, Microsystem Technologies, 22(2), 337–347, 2016
- •Design of a compact silicon-based integrated passive band-pass filter with two tunable finite transmission zeros, Microelectronics Journal, 49, 43-48, 2016
- •Study on a Conformal Shielding Structure with Conductive Adhesive Coated on Molding Compound in 3D Packages, IEEE Transactions on Electromagnetic Compatibility, 58(2), 442-447, 2016
- •Deep dry etching of fused silica using C4F8/Ar inductively coupled plasmas, J Mater Sci: Mater Electron, 7, 2016
- •Investigation of fused silica glass etching using C4F8/Ar inductively coupled plasmas for through glass via (TGV) applications, Microsystem Technologies,22(1), 119–127, 2016
- •Diagnosis and optimization of a power distribution network by extracting its parasitic inductances and building a lumped circuit model, Microsystem Technologies, 1-8, 2015
- •Tunable photonic microwave generation by directly modulating a dual-wavelength amplified feedback laser, Optics Communications, 345(15 ), 57-61, 2015
- •Complementary metal–oxide–semiconductor compatible 1060 nm photodetector with ultrahigh gain under low bias, Optics letter, 40(19), 4440-4443, 2015
- •TSV Backside Reveal by a Wet Etching Process. ECS Transactions, 60(1):401-406. 2014
- •The effect of temporary bonding on post processing in TSV interposer manufacturing, Microsystem Technologies, 1-7, 2014
- •A Surface Mounting Embedded Optical Transceiver with Bi-directional Data Rate of 8 Channels × 10Gbps, Fiber and Integrated Optics,33, 1-2,2014