新闻资讯|华进半导体封装先导技术研发中心有限公司

新闻资讯

新闻资讯

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12-04

2019

全球IC封测市场止跌回升，背后原因并不简单。

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10-25

2019

于燮康：设计和晶圆制造业仍是我国产业链的短板

原创： JSSIA 集成电路园地于燮康：设计和晶圆制造业仍是我国产业链的短板

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10-21

2019

中科智芯封测项目生产设备正式进场

由华进半导体研发项目孵化的、位于徐州市经济开发区的江苏中科智芯集成科技有限公司，一期厂房建设日前已经具备设备进场条件。2019年10月15日，激光打标机、倒装贴...

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09-27

2019

Characterization of the Hamamatsu VUV4MPPCs for nEXO, Nuclear Inst. And Methods in Physics Research, A,2019

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09-27

2019

Warpage Prediction and Optimization for Embedded Silicon Fan Out (eSiFO) Wafer Level Packaging based on an Extended Theoretical Model,IEEE Transactions on Components, Packaging and Manufacturing Technology ，Volume: 9 , Issue: 5，2019.3

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09-27

2019

Imaging individual Ba atoms in solid xenon for barium tagging in nEXO, Nature, vol 569,2019.5

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09-27

2019

Three-dimensional force-ﬁeld microscopy with optically levitated microspheres, PHYSICAL REVIEW A 99, 023816 (2019) IF=2.925.

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09-27

2019

Sensitivity and discovery potential of the proposed nEXO experiment to neutrinoless double-beta decay, PHYSICAL REVIEW C, 2018，Journal Volume: 97; Journal Issue: 6; Journal ID: ISSN 2469-9985

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09-27

2019

Characterization of an Ionization Readout Tile for nEXO, Journal of Instrumentation,2018

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09-27

2019

Study of silicon photomultiplier performance in external electric ﬁelds, JOURNAL OF INSTRUMENTATION, 13，2018.9

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