新闻资讯|华进半导体封装先导技术研发中心有限公司

新闻资讯

新闻资讯

News

09-27

2019

VUV-Sensitive Silicon Photomultipliers for Xenon Scintillation Light Detection in nEXO, IEEE TRANSACTIONS ON NUCLEAR SCIENCE, VOL. 65, NO. 11, NOVEMBER 2018

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09-27

2019

Design of a silicon-based wideband bandpass filter using aggressive space mapping. IEICE Electronics Express. 2018; 15(21)

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09-27

2019

Design of a K-band two-layer microstrip interdigital filter exploiting aggressive space mapping. Journal of Electromagnetic Waves and Applications. 2018; 32(17):2281-2291.

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09-27

2019

Design and Implementation of a Compact 3-D Stacked RF Front-End Module for Micro Base Station, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2018 (99): 1-12.

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09-27

2019

Warpage simulation and experimental veriﬁcation for 320mm×320mm panel level fan-out packaging based on die-ﬁrst process, Microelectronics Reliability, 83(29-38), 2018.2.14

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09-27

2019

Design and Verification of Sub-6GHz RoF Transceiver Employing LR4 TOSA and ROSA Packaging Structure, Microwave and Optical Technology Letters, 2018

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09-27

2019

Study on Magnetic Probe Calibration in Near-field Measurement System for EMI Application, Journal of Electronic Testing, 06, 2017

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09-27

2019

Investigation of intermetallic compound and voids growth in fine-pitch Sn–3.5Ag/Ni/Cu microbumps, Journal of Materials SCIence: Materials in Electronics, 2017.

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09-27

2019

Thermo-mechanical reliability analysis of a RF SiP module based on LTCC substrate, Microelectronics Reliability, 79, 38-47, 2017

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09-27

2019

Experimental and Numerical Study of 3D Stacked Dies under Forced Air Cooling and Water Immersion, Microelectronics Reliability, 74, 34–43, 2017

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