新闻资讯|华进半导体封装先导技术研发中心有限公司

新闻资讯

新闻资讯

News

09-27

2019

Thermo-mechanical reliability analysis of a RF SiP module based on LTCC substrate, Microelectronics Reliability, 79, 38-47, 2017

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09-27

2019

Experimental and Numerical Study of 3D Stacked Dies under Forced Air Cooling and Water Immersion, Microelectronics Reliability, 74, 34–43, 2017

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09-27

2019

Design and fabrication of a small-form transmitter optical subassembly for 100Gbps short reach optical interconnect, Microwave and Optical Technology Letters, 59(12), 3181-3185, 2017

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09-27

2019

A wet etching approach for the via-reveal of a wafer with through silicon vias, Microelectronic Engineering, 179:31-36, 2017

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09-27

2019

Design and implementation of a rigid-flex RF front-end System-in-Package, Microsystem Technologies, 23(10), 4579–4589, 2017

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09-27

2019

Design and implementation of a high-coupling and multi-channel optical transceiver with a novel packaging structure, IEEE TRANSACTIONS ON COMPONENTS,PACKAGING AND MANUFACTURING TECHNOLOGY, 7(11), 1882 – 1890,2017

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09-27

2019

Fabrication and performance analysis of a high-coupling-efficiency and convenient-integration optical transceiver, Optoelectronics Letters, 13(4), 0250-0253, 2017

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09-27

2019

Experimental Verification and Optimization Analysis of Warpage for Panel Level Fan-out Package IEEE Transactions on Components, Packaging and Manufacturing Technology, 7(10), 1721-1728, 2017

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09-27

2019

A MEMS thermal shear stress sensor produced by a combination of substrate-free structures with anodic bonding technology, Applied Physics Letters, 109(2),023512-1/023512-5,2016.

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09-27

2019

Stress analysis and parametric studies for a ultralow-k chip in the flip chip process，Microelectronics Reliability, 65, 198-204, 2016

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