新闻资讯|华进半导体封装先导技术研发中心有限公司

新闻资讯

新闻资讯

News

09-27

2019

Thermal stress analysis of the low-k layer in a flip-chip package, Microelectronic Engineering, 163, 78–82, 2016

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09-27

2019

Silicon interposer process development for advanced system integration, J. Microelectronic Engineering, 156, 50-54, 2016

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09-27

2019

Optimization and validation of thermal management for a RF front-end SiP based on rigid-flex substrate, Microelectronics Reliability, 65, 98-107, 2016

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09-27

2019

Research on Optical Transmitter and Receiver Module Used for High Speed Interconnection between CPU and Memory Fiber and Integrated Optics, 35(5), 18, 2016

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09-27

2019

High Frequency Characterization and Analysis of Through Silicon Vias and Coplanar, Microsystem Technologies, 22(2), 337–347, 2016

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09-27

2019

Design of a compact silicon-based integrated passive band-pass filter with two tunable finite transmission zeros, Microelectronics Journal, 49, 43-48, 2016

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09-27

2019

Study on a Conformal Shielding Structure with Conductive Adhesive Coated on Molding Compound in 3D Packages, IEEE Transactions on Electromagnetic Compatibility, 58(2), 442-447, 2016

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09-27

2019

Deep dry etching of fused silica using C4F8/Ar inductively coupled plasmas, J Mater Sci: Mater Electron, 7, 2016

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09-27

2019

Investigation of fused silica glass etching using C4F8/Ar inductively coupled plasmas for through glass via (TGV) applications, Microsystem Technologies,22(1), 119–127, 2016

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09-27

2019

Diagnosis and optimization of a power distribution network by extracting its parasitic inductances and building a lumped circuit model, Microsystem Technologies, 1-8, 2015

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