【第四期】 华进论坛：Recent Advances on Nano-materials for Advanced Electronic, Photonic, MEMS Packaging Applications

时间：2013年4月12日（星期五）9:45-11:15

地点：NCAP 304会议室

主讲人：汪正平 （C. P. Wong）教授

参与对象：公司全体研发人员、研究生和其他感兴趣的同事

主办单位：华进半导体封装先导技术研发中心有限公司

支持单位：先进封装技术联合体

【讲座概要】

The advance of modern semiconductor technology is mainly due to the advances of high density, 3D packaging. Current main frame computers and cell phones are just two of these examples. They are multi-functions, very reliable, low cost and small foot prints. To realize these advanced packaging, advanced materials, especially polymeric materials are needed. These include the use of polymers as: adhesives (both conductive and non conductive for die attach and assembly interconnects), interlayer dielectrics (low k, low loss dielectrics for high speed and low loss signal transmission), encapsulants (underfills for discrete and wafer level packages for device protection), high thermal conductive thermal interfacial materials (TIMs) for power electronics thermal dissipations, etc. In this presentation, I will review some past history of nano-materials and technologies. One example is the rare-earth(lanthanide/actinide) porphrin complexes, a class of nano-functional materials that I have developed during my graduate work and recent advances on polymeric materials and polymer nanocomposites that are currently being investigated for use as : lead-free flexible electrically conductive adhesives (ECAs) with flexible/stretchable properties, self assembly monolayer molecular wires for fine pitch and high current density interconnects, flip chip and wafer level underfills, nano lead-free alloys for low temperature interconnects, well-aligned carbon nanotubes and graphenes for high current and high thermal interface materials(TIMs), and superhydrophobic self-clean lotus surface coatings for MEMS and high efficiency solar cell applications.

【主讲人简介】

Prof. C. P. Wong is currently Dean of the Faculty of Engineering at the Chinese University of Hong Kong. He is on a no pay long leave from the Georgia Institute of Technology (GT) where he is a Regents’ Professor and the Charles Smithgall Institute Endowed Chair at the School of Materials Science and Engineering. He received his B.S. degree from Purdue University, and his MS. and Ph.D. degrees from the Pennsylvania State University. After his doctoral study, he was awarded a two-year postdoctoral fellowship with Nobel Laureate Professor Henry Taube at Stanford University.  Prior to joining GT in 1996, he was with AT&T Bell Laboratories for many years and became an AT&T Bell Laboratories Fellow in 1992 for his seminal contributions to low-cost high-performance packaging of semiconductor devices and components.

He received many awards, among those, the AT&T Bell Labs Fellow Award in 1992, the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society Outstanding Sustained Technical Contributions Award in 1995, the IEEE Educational Activity Board Outstanding Education Award in 2001, the IEEE CPMT Society Exceptional Technical Contributions Award in 2002, the Georgia Tech Class 1934 Distinguished Professor Award in 2004, named holder of the Charles Smithgall Institute-Endowed Chair, the IEEE Components, Packaging and Manufacturing Technology  Field Award in 2006(hailed by the IEEE as “Father of Modern Semiconductor Packaging”), the Sigma Xi’s Monie Ferst Outstanding Educational Award in 2007, the Society of Manufacturing Engineers’ Total Excellence in Electronic Manufacturing Award in 2008 and the 2012 International Dresden Barkhausen Award from Germany.

He holds over 65 U.S. patents, and has published over 1,000 technical papers, co-authored and edited 10 books and is a member of the National Academy of Engineering of the USA since 2000.